Inside the CameMake Factory
From sourcing to shipping: a transparent tour of CameMake’s manufacturing
At CameMake, camera modules aren’t just assembled, they’re engineered, calibrated, and verified to ship straight into production. This tour shows every step, from component sourcing and SMT to CSP/COB sensor assembly, Automatic/Active Alignment (AA), optical calibration, end-of-line test, QA traceability, and packing & global logistics.
Sales & Technical Discovery
Every successful camera module starts with a clear understanding of the application. Our global network of sales and technical sales engineers work closely with you to define exactly what your product needs — from performance targets to physical constraints. This collaboration blends commercial insight with deep technical expertise, ensuring that the final design is practical, manufacturable, and meets your market goals.
We discuss your intended use case, whether it’s industrial automation, AIoT edge devices, robotics, inspection systems, consumer electronics, or specialist tools like endoscopes and borescopes. We match the right interface — USB 2.0/3.x UVC for universal connectivity, MIPI CSI-2 for embedded platforms such as Raspberry Pi or NVIDIA Jetson, or DVP/SPI for microcontroller-based systems — and confirm key performance metrics such as resolution, frame rate, HDR/WDR capability, low-light sensitivity, and shutter type.
Our team also considers optical requirements, from narrow telephoto lenses to ultra-wide and panoramic fields of view, plus filter options such as IR-cut or IR-pass, distortion control, and depth of field. Mechanical and electrical constraints are addressed early, including board format (rigid, FPC, or rigid-flex), mounting points, connector placement, power budgets, EMI/ESD protection, and thermal design.
By the end of this stage, you receive a clear requirements brief that forms the foundation for engineering. It includes a shortlist of recommended sensors and optics, an initial connector and pinout proposal, and a roadmap from prototype to mass production with estimated timelines and cost ranges.
Engineering Design & DFM
Once your requirements are clear, our engineering team transforms them into a complete, production-ready camera module design. We select the optimal image sensor from Sony, OmniVision, onsemi, SmartSens, or others, matching resolution, frame rate, shutter type (rolling or global), HDR/WDR capabilities, and low-light performance to your application.
Our optics engineers model the lens system to achieve your exact field of view — from narrow inspection to ultra-wide, fisheye, or panoramic — while controlling distortion, matching the chief ray angle (CRA), and specifying the right filter type (IR-cut or IR-pass) and coatings.
On the electronics side, we architect the entire signal path, whether it’s USB 2.0/3.x UVC for plug-and-play devices, high-speed MIPI CSI-2 for embedded platforms like Raspberry Pi or NVIDIA Jetson, or DVP/SPI for microcontrollers such as Arduino and ESP32. We define power management, clocking, level shifting, GPIO functions, and ensure perfect signal integrity for high-speed lanes.
Mechanically, we design the PCB or FPC layout, choose between rigid, flexible, or rigid-flex formats, plan connector orientation, and establish the exact Z-height and mounting points to fit seamlessly into your product. Early in the process we decide whether CSP (chip-scale package) or COB (chip-on-board) is best for your build, balancing performance, size, and cost.
Finally, our DFM process ensures every design can be manufactured at scale with high yield. We prepare schematics, 3D mechanical models, Gerbers, and an initial calibration and active alignment plan, so your prototype flows directly into mass production without costly redesigns.
Incoming Quality Control (IQC)
Before a single component reaches the production line, it passes through our incoming quality control process. This ensures that every lens, image sensor, PCB, flex cable, connector, and mechanical part meets the exact specifications defined during design. High-quality components are the foundation for reliable, high-performance camera modules, and IQC is where that standard begins.
Each part is inspected for dimensional accuracy, cosmetic quality, and compliance with its technical datasheet. PCBs and FPCs are checked for correct hole positions, surface finish, and flatness to prevent assembly issues later. Lenses and optical filters undergo visual and optical testing to verify coatings, clarity, and transmission properties, whether they are IR-cut, IR-pass, or specialty filters.
Electronic components are verified for part numbers, lot traceability, and ESD handling compliance. Moisture-sensitive parts follow strict baking and storage protocols according to their MSL rating, ensuring solderability and long-term reliability. Adhesives, solder paste, and encapsulants are tested for viscosity and consistency to guarantee repeatable application during assembly.
By enforcing these checks before production starts, we eliminate potential defects at the source and maintain the high yield and consistent performance that customers expect from CameMake camera modules.
SMT Assembly
With components cleared through IQC, production begins with surface-mount technology (SMT) assembly. This is where the electronic foundation of the camera module is built, placing and soldering all active and passive components onto the PCB or FPC with precision and speed.
The process starts with stencil printing solder paste onto the board, ensuring each pad receives exactly the right amount for a reliable joint. Automated solder paste inspection (SPI) verifies deposition accuracy before moving to high-speed pick-and-place machines, which position components such as processors, memory, oscillators, power regulators, connectors, and support ICs with micron-level precision.
Once populated, boards pass through a reflow oven, where carefully profiled temperature zones melt and solidify the solder without damaging sensitive components. For chip-scale packaged (CSP) image sensors, this reflow process mounts the sensor directly to the board. Post-reflow, automated optical inspection (AOI) checks for solder defects, misalignments, or missing parts, while X-ray inspection verifies hidden joints under BGAs and LGAs.
Every SMT line is tuned for the high-speed signaling and low-noise requirements of modern camera modules, ensuring signal integrity for interfaces like USB 3.x, MIPI CSI-2, and DVP/SPI. By the end of this stage, the board is fully assembled and electrically ready for the next step in the production process.
Sensor Assembly (CSP and COB)
The image sensor is the heart of every camera module, and at CameMake we use two distinct assembly methods depending on the size, performance, and application requirements: Chip-Scale Package (CSP) and Chip-On-Board (COB).
CSP assembly mounts a packaged image sensor directly onto the PCB or FPC using the SMT reflow process. This approach is fast, repeatable, and ideal for high-volume builds. After reflow, X-ray inspection confirms solder joint integrity, and optional underfill can be applied for extra mechanical strength and thermal stability. CSP is widely used in our USB, MIPI, and platform-specific modules where compact size and efficient throughput are key.
COB assembly begins with a bare silicon die rather than a packaged sensor. The die is precisely attached to the substrate using high-accuracy die bonding equipment, then connected to the PCB pads via ultra-fine wire bonds. The sensor is encapsulated with a protective epoxy (glob-top) to shield the wire bonds and ensure environmental protection. COB enables extremely compact designs with minimal stack height, making it the preferred choice for miniature camera heads such as endoscope modules.
Both methods are executed under strict cleanroom conditions to prevent dust or contamination, which can degrade image quality. Whether CSP or COB is chosen, the result is a perfectly mounted sensor ready for lens integration and alignment.
CSP Sensor Assembly
In the CSP (Chip-Scale Package) process, the image sensor arrives as a fully packaged device, ready to be soldered onto the PCB or FPC. Placement is handled by high-precision SMT equipment, followed by reflow soldering under a carefully controlled temperature profile to ensure perfect joint formation without stressing the sensor.
After reflow, every CSP-mounted sensor undergoes X-ray inspection to verify hidden solder joints and ensure alignment accuracy. Optional underfill can be applied to reinforce the sensor against mechanical shock, vibration, and thermal cycling — particularly important for ruggedized or industrial applications.
CSP assemblies are ultrasonically cleaned to remove any residual flux or contaminants from the reflow process. This cleaning is essential for preventing ionic residue, which can lead to corrosion or electrical leakage over time. Once cleaned, the boards are dried, visually inspected, and ready for the next stage in production.
This method delivers high throughput, excellent consistency, and is ideal for volume production runs of USB, MIPI, Raspberry Pi, and NVIDIA Jetson camera modules.
COB Sensor Assembly
The COB (Chip-On-Board) process starts with the bare silicon die rather than a packaged component. The die is picked and placed onto the PCB or FPC substrate with sub-micron accuracy, then bonded using specialized adhesives. Ultra-fine gold or aluminum wire bonds connect the die pads to the board’s circuitry, forming the critical electrical interface.
The wire bonding process is both technically demanding and visually striking, making it a fascinating step to show in video form. Each bond is verified for alignment, bond strength, and electrical continuity. Once bonding is complete, the die and wires are encapsulated with a protective epoxy, cured under controlled conditions to protect against moisture, dust, and mechanical stress.
Cleaning for COB assemblies follows a specialized, non-ultrasonic method to protect the delicate wire bonds and encapsulant. This ensures the surface remains pristine without risking damage to the fine bonding structure. COB is the go-to choice for ultra-compact, thin-profile camera modules such as those used in endoscopes, wearables, and other space-constrained devices.
Sensor Surface Inspection
After the CSP or COB mounted sensor is cleaned, each unit undergoes a dedicated sensor surface inspection to ensure it is free from dust, scratches, or other defects that could impact image quality. This inspection is critical, as even microscopic particles or surface blemishes can introduce permanent image artifacts once the lens is mounted.
Depending on the production flow, this step can be carried out manually by trained technicians under high-magnification microscopes, or automatically using machine vision systems that detect contamination, foreign particles, or physical damage at the pixel level.
For CSP assemblies, ultrasonic cleaning is followed by a careful visual and optical check of the sensor glass cover. For COB assemblies, the inspection focuses on the die surface and protective encapsulant, ensuring that no residue from bonding or encapsulation remains.
Only sensors that pass this inspection move on to the lens holder or lens assembly stage, guaranteeing that every module starts its optical build-up from a perfectly clean and defect-free imaging surface.
Autofocus Lens Holder & Lens Pre-Assembly
Before a lens is mounted onto the sensor, our production line prepares the autofocus lens holder assembly. This precision-built component ensures the optical stack can move smoothly and accurately during autofocus operation, maintaining consistent image quality across the entire focus range.
The process begins with the lens holder body, which is cleaned and inspected for dimensional accuracy, thread integrity, and surface finish. Any dust or debris at this stage could compromise focus performance, so holders are processed in a controlled environment.
Next, the selected lens element — whether standard, wide-angle, or telephoto — is matched to the holder. In the case of autofocus designs, the lens may be mounted within a moving barrel or equipped with a voice-coil motor (VCM) mechanism. Assembly technicians, or in some cases fully automated equipment, seat the lens into the holder with micron-level precision, ensuring perfect centration and tilt.
The assembly is then tested for smooth movement, correct mechanical travel, and proper optical alignment relative to the holder’s mechanical axis. This ensures that when the lens is installed onto the sensor module, the autofocus system operates reliably and delivers sharp, consistent results.
By preparing the autofocus lens holder as a subassembly, we reduce complexity at the final lens mounting stage and ensure every autofocus module meets both mechanical and optical specifications.
Lens and Filter Assembly
With the autofocus holder or fixed-focus lens mount prepared, we move to the stage where optics are integrated with the sensor. This step defines the module’s final image quality, as it establishes the mechanical and optical relationship between lens, filter, and image sensor.
Depending on the project requirements, this assembly can be done in three ways:
- Lens Assembly Robots – Fully automated machines position the lens above the sensor, apply adhesive in a controlled pattern, and lower the lens into place with precise centration and tilt control.
- Active Alignment (AA) – For high-end modules, the lens is dynamically adjusted in up to six degrees of freedom while live images are analyzed for MTF, SFR, CRA, and shading. Once optimal alignment is reached, the lens is locked in place with UV or thermal curing while still clamped in position.
- Manual Assembly – For prototypes, small batches, or special mechanical designs, skilled technicians assemble lenses by hand using precision fixtures, microscopes, and torque-controlled tools.
At this stage, filters such as IR-cut or IR-pass are also integrated, either as part of the lens assembly or mounted separately. These filters are inspected for coating quality and optical clarity before installation to ensure accurate color reproduction and desired spectral response.
The adhesive used in this step is applied under cleanroom conditions, with careful control of dot size, viscosity, and curing profile to prevent lens shift or contamination. Whether done by robot, active alignment system, or technician, the result is a mechanically secure, optically accurate lens-sensor assembly ready for calibration.
Focusing – Achieving Sharp, Accurate Images
Every camera module leaving CameMake’s production line must deliver images that are crisp, detailed, and ready for integration into the customer’s application. The focusing stage ensures that each lens-sensor combination is set to its exact optical sweet spot.
Depending on the project and module type, focusing is carried out in one of two ways:
- Automated Autofocus Machines – For high-volume production, precision autofocus stations drive the lens through its focus range while analyzing live image quality in real time. Using advanced algorithms, the system identifies the point of maximum sharpness, then locks the lens in place with adhesive curing under tightly controlled conditions.
- Manual Precision Focusing – For prototypes, low-volume runs, or modules with unique mechanical designs, our trained technicians focus each unit manually. Using high-magnification displays and precision fixtures, they adjust the lens position until perfect sharpness is achieved across the specified focus range.
In both methods, focusing is performed under lighting and target conditions that replicate the module’s intended use — whether that’s close-range inspection, long-distance imaging, or a wide depth of field for general-purpose vision. This guarantees that when your camera module arrives, it produces optimal results in its real-world application without further adjustment.
By combining cutting-edge automation with skilled craftsmanship, CameMake ensures every camera module is focused for maximum clarity, no matter the complexity or scale of production.
Lens Gluing and Securing
Once the lens is mounted, it must be permanently secured to guarantee long-term optical stability. This is achieved using a specialized adhesive selected for its strength, durability, and compatibility with optical assemblies. We use UV-curable adhesives for rapid, high-precision bonding, heat-cure epoxies for rugged environments, and low-outgassing optical glues for sensitive applications where clarity and cleanliness are critical.
The gluing process takes place in a cleanroom environment to prevent dust contamination. Precision dispensing systems apply the adhesive in controlled micro-dots or continuous rings, ensuring an even bond without intrusion into the optical path. The lens is held in exact position while the adhesive cures — either under UV light for instant fixation or in a temperature-controlled oven for thermal curing — so the alignment remains unchanged.
In high-end active alignment (AA) modules, this step is integrated into the AA process itself, with the adhesive applied and cured while the lens is actively aligned. In all cases, the result is a mechanically secure, optically stable lens assembly that will maintain performance over years of use, even under vibration, shock, or extreme temperatures.
Firmware Loading
Some camera modules operate using industry-standard protocols such as UVC and require no firmware customization. Others are built for specific platforms, sensors, or customer requirements, and need firmware to be programmed before leaving the factory.
When firmware loading is required, modules are connected to dedicated programming stations that handle flashing, verification, and configuration automatically. This can include:
- Sensor register presets for optimal exposure, gain, and frame rate
- ISP (Image Signal Processor) tuning profiles for color balance, sharpness, and noise reduction
- Special modes such as HDR/WDR, global shutter timing, or trigger synchronization
- Customer-specific command sets or USB descriptors
Every programmed module is read back and checksum-verified to ensure the firmware is correctly installed and free from corruption. This process guarantees that the camera will work exactly as intended when integrated into the final product.
Functional Testing
Before a camera module moves further down the line, it undergoes functional testing to confirm that every feature operates as designed. This stage verifies both the electronic interface and the optical system, ensuring the module is fully operational in real-world conditions.
Each unit is connected to a dedicated test platform matching its intended interface — USB 2.0/3.x UVC, MIPI CSI-2, or DVP/SPI. We check image streaming at the specified resolution and frame rate, verify exposure control and gain adjustment, and confirm that any special functions such as autofocus, zoom, HDR/WDR, or trigger synchronization are working correctly.
Electrical tests confirm power consumption, communication stability, and signal integrity over the intended cable length. For optical checks, we assess focus sharpness, field of view, and any specified optical features, such as IR-pass or IR-cut filter behavior.
Modules that pass functional testing proceed to final inspection, while any unit that fails is sent to our repair and diagnostic team for detailed analysis and rework if possible. This ensures only fully functional modules progress toward packaging and shipment.
Final Testing and Dust Inspection
Even after a module has passed functional testing, it undergoes one more round of rigorous inspection before it is cleared for shipment. Final testing confirms that performance remains consistent and that the module meets all mechanical, optical, and electrical specifications.
The process includes a repeat of key functional checks — resolution, frame rate, exposure stability, and special features — to ensure nothing has shifted during handling. The module is also inspected for cosmetic quality, verifying that housings, connectors, and PCBs are free from scratches, dents, or assembly marks.
A critical part of this step is dust inspection. Under high-intensity lighting and magnification, trained technicians check the optical path for any particles inside or on the lens surface. Even the smallest speck of dust can affect image quality, so modules that do not pass this inspection are returned to cleanroom assembly for corrective action.
Only after clearing all tests and passing dust inspection does the module move to the protection and identification stage.
Lens Protection, Identification, and Traceability
Once a camera module has passed final testing, it is prepared for safe storage and shipment. The lens is immediately fitted with a protective cap or sealed with a clean, anti-static film to prevent scratches, dust accumulation, or contamination during handling.
Each module is then labeled with a unique identification code, such as a laser-marked serial number or 2D barcode. This code links directly to our production database, where all manufacturing records, calibration data, and quality control results are stored. This traceability ensures that any module can be tracked back to its exact production lot, component sources, and test history — an essential requirement for OEMs and industrial customers.
In addition to identification for internal tracking, customer-specific markings such as logos, part numbers, or compliance symbols can also be applied at this stage, supporting ready integration into the customer’s supply chain.
With the optics protected and full traceability in place, the module is ready for packaging and dispatch.
Warehouse and Shipping
After passing all inspections and receiving its protective lens cover and identification marking, the camera module moves to final packaging. Modules are packed in anti-static, dust-free trays or moisture barrier bags, depending on their sensitivity and storage requirements. Each package is labeled with product details, quantity, and handling instructions to ensure proper care in transit.
Finished goods are stored in our climate-controlled warehouse, where temperature and humidity are monitored to maintain optimal component stability. Stock is organized for rapid order fulfillment, whether shipping single prototypes, small production batches, or large-volume orders.
When an order is released, our logistics team prepares the shipment with all necessary export documentation, compliance certificates, and tracking details. For sensitive or high-value shipments, we offer shock-protected and temperature-controlled transport options to ensure the modules arrive in perfect condition.
From the first design discussion to final delivery, every CameMake camera module follows a strict, traceable process — ensuring that when it reaches you, it’s fully tested, protected, and ready to integrate.
CameMake - One Global Factory, Infinite Possibilities
From concept to mass production, CameMake operates as a single, unified manufacturing powerhouse — delivering high-quality camera modules to customers all over the world. Our integrated factory network combines advanced automation, precision engineering, and global logistics into one seamless workflow.
With engineering, production, and quality control all under one roof, every camera module we ship — whether it’s for USB, MIPI, DVP/SPI, Raspberry Pi, NVIDIA Jetson, or ultra-compact specialty applications — meets the same strict performance and reliability standards.
From North America to Europe, Asia to Oceania, our products power industrial automation, AIoT devices, consumer electronics, robotics, vision systems, and countless other innovations. Wherever you are, CameMake delivers — on time, to spec, and ready to perform.
One global factory. One standard of quality. Infinite applications.
